illidan
PCAXE Addicted
- Učlanjen(a)
- 01.04.2009.
- Poruka
- 6.793
- Rezultat reagovanja
- 3.205
Moja konfiguracija
CPU & cooler:
amd 5800x3d under ek nucleus cr240 dark
Motherboard:
asus proart b550
RAM:
g.skill trident z neo 32gb
VGA & cooler:
nvidia rtx 3060ti founders edition
Display:
asus vg27aql1a
HDD:
samsung 980 pro 1tb, samsung 860 qvo 1tb
Sound:
ifi zen dac v2 with presonus eris 3.5, akg k712 pro and kz zs10 pro
Case:
corsair 4000d white airflow with phanteks t30 fans
PSU:
be quiet! dark power 12 750w 80+ titanium
Mice & keyboard:
lamzu atlantis mini and kbd.fans tofu65 e-white
Internet:
optical cable
View this graphic presentation offering a high-level demonstration of the process for manufacturing a central processing unit (CPU), which operates in every PC today. Here you can catch a glimpse of some of the amazingly sophisticated work going on daily inside Intel's cutting-edge silicon manufacturing fabs.
Download the "Making of a Chip" presentation (PDF 375KB)
Sand -- With about 25% (mass) Silicon is – after Oxygen – the second most common compound in the earth's crust. Sand – especially Quartz - has high percentages of Silicon in the form of Silicon dioxide (SiO2) and is the base ingredient for semiconductor manufacturing.
Wafer -- scale: wafer level (~300mm / 12 inch) - The wafers are polished until they have flawless, mirror-smooth surfaces. Intel buys those manufacturing ready wafers from third party companies. Intel’s highly advanced 45nm High-K/Metal Gate process uses wafers with a diameter of 300 millimeter (~12 inches). When Intel first began making chips, the company printed circuits on 2-inch (50mm) wafers. Now the company uses 300mm wafers, resulting in decreased costs per chip.
Individual Die -- scale: die level (~10mm / ~0.5 inch) - This is an individual die which has been cut out in the previous step (slicing). The die shown here is a die of an Intel®*Core™ i7 Processor.
Packaging -- scale: package level (~20mm / ~1 inch) - The substrate, the die and the heatspreader are put together to form a completed processor. The green substrate builds the electrical and mechanical interface for the processor to interact with the rest of the PC system. The silver heatspreader is a thermal interface where a cooling solution will be put on to. This will keep the processor cool during operation.
Processor -- scale: package level (~20mm / ~1 inch) - Completed processor (Intel®*Core™ i7 Processor in this case). A microprocessor is the most complex manufactured product on earth. In fact, it takes hundreds of steps – only the most important ones have been visualized in this picture story - in the world's cleanest environment (a microprocessor fab) to make microprocessors.
Retail Package -- scale: package level (~20mm / ~1 inch) - The readily manufactured and tested processors (again Intel®*Core™ i7 Processor is shown here) either go to system manufacturers in trays or into retail stores in a box such as that shown here.
ceo proces mozete videti ovde
Download the "Making of a Chip" presentation (PDF 375KB)
Sand -- With about 25% (mass) Silicon is – after Oxygen – the second most common compound in the earth's crust. Sand – especially Quartz - has high percentages of Silicon in the form of Silicon dioxide (SiO2) and is the base ingredient for semiconductor manufacturing.
Wafer -- scale: wafer level (~300mm / 12 inch) - The wafers are polished until they have flawless, mirror-smooth surfaces. Intel buys those manufacturing ready wafers from third party companies. Intel’s highly advanced 45nm High-K/Metal Gate process uses wafers with a diameter of 300 millimeter (~12 inches). When Intel first began making chips, the company printed circuits on 2-inch (50mm) wafers. Now the company uses 300mm wafers, resulting in decreased costs per chip.
Individual Die -- scale: die level (~10mm / ~0.5 inch) - This is an individual die which has been cut out in the previous step (slicing). The die shown here is a die of an Intel®*Core™ i7 Processor.
Packaging -- scale: package level (~20mm / ~1 inch) - The substrate, the die and the heatspreader are put together to form a completed processor. The green substrate builds the electrical and mechanical interface for the processor to interact with the rest of the PC system. The silver heatspreader is a thermal interface where a cooling solution will be put on to. This will keep the processor cool during operation.
Processor -- scale: package level (~20mm / ~1 inch) - Completed processor (Intel®*Core™ i7 Processor in this case). A microprocessor is the most complex manufactured product on earth. In fact, it takes hundreds of steps – only the most important ones have been visualized in this picture story - in the world's cleanest environment (a microprocessor fab) to make microprocessors.
Retail Package -- scale: package level (~20mm / ~1 inch) - The readily manufactured and tested processors (again Intel®*Core™ i7 Processor is shown here) either go to system manufacturers in trays or into retail stores in a box such as that shown here.
ceo proces mozete videti ovde
